| 摘要 |
[PROBLEMS] To provide a polishing slurry which is remarkably inhibited in the occurrence of scratch, dishing or erosion. [MEANS FOR SOLVING PROBLEMS] A polishing slurry containing organic particles (A), an oxidizing agent, and a complexing agent, wherein the organic particles (A) are those obtained by coating part of the surface of an organic particle (B) having on the surface functional groups reactive with the metal to be polished with a resin (C) free from functional groups reactive with the metal to be polished and the organic particle (B) is preferably one containing a copolymer obtained by polymerization of a monomer composition comprising 1 to 50 wt% of one or more monomers selected from among carboxyl monomers, hydroxyl monomers, amino monomers, acetoacetoxy monomers, and glycidyl monomers and 99 to 50 wt% of other monomers, with each percentage based on the whole of the monomers. ® KIPO & WIPO 2007
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