Copper electrolysis solution for production of electrolytic copper foil and process for producing electrolytic copper foil

摘要

This invention is for providing a copper electrolyte solution producing an electrolytic copper foil capable of providing a foil in which the shape and size of mountains of the rough surface of the deposited foil are uniform and which has low roughness, substantially without decrease of the yield of deposited foil by controlling the molecular weight and the concentration of protein, etc. and a method of producing an electrolytic copper foil using the same. In this copper electrolyte solution for producing an electrolytic copper foil, protein in the copper electrolyte solution preferably has a number average molecular weight M_n of 1000 to 2300 and the copper electrolyte solution preferably has a protein concentration of 2 to 4.5 ppm. The electrolyte solution preferably has Cu²⁺ concentration of 60 to 100 g/L. In addition, the electrolyte solution preferably has a free SO₄^2- concentration of 60 to 250 g/L. Also the electrolyte solution preferably has Cl^- concentration of 0.5 to 2.0 ppm. The method of producing the electrolytic copper foil employs the copper electrolyte solution therefor.