| 摘要 |
A cooling system for a reflow soldering apparatus is provided to intensify a soldering strength of a print board by drastically improving cooling efficiency in comparison with a conventional blowing structure. In a cooling system for a reflow soldering apparatus, a heating room(10) is installed in parallel along a conveyor on which a print board is mounted. A cooling room(20) is coupled to face a pair of top and bottom punching nozzles(21,22). Top and bottom heat absorbing devices(30a,30b) are connected to a rear surface side of each top and bottom punching nozzle(21,22) and a heat absorbing material is mounted to circularly transport cooling water therein. A cooling device is connected to the top and bottom heat absorbing devices(30a,30b) through a pipe. And, a cooling water storage water tank supplies the cooling water to the cooling device through a cooling water supplying pump.
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