发明名称 |
ALIGNMENT PROCESSING MECHANISM AND SEMICONDUCTOR PROCESSING DEVICE USING IT |
摘要 |
<p>An alignment processing mechanism 10 according to the present invention includes: a conveying mechanism 11 for conveying a substrate W to be processed, an alignment mechanism 12 for aligning the substrate W conveyed by the conveying mechanism 11 to a predetermined direction, and a buffer mechanism 13 for relaying the substrate W from the conveying mechanism 11 to the alignment mechanism 12. The buffer mechanism 13 is adapted to temporarily hold the substrate W conveyed by the conveying mechanism 11, and to pass the temporarily holding substrate W to the alignment mechanism 12 based on a state of the alignment mechanism 12. According to the present invention, the alignment mechanism 12 can be used with greater efficiency in order to achieve a high speed of an alignment process. <IMAGE></p> |
申请公布号 |
EP1079429(B1) |
申请公布日期 |
2007.01.24 |
申请号 |
EP19990910835 |
申请日期 |
1999.04.02 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
OZAWA, MASAHITO;NARUSHIMA, MASAKI |
分类号 |
H01L21/68;B65G49/07;H01L21/677 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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