| 摘要 |
Provided is a polyurethane polishing pad, which causes no deterioration of polishing efficiency by abrasion heat and solubility in slurry upon polishing, enables high-temperature polishing, and has an improved polishing rate and an increased service life. The polyurethane polishing pad without pores and air bubbles is obtained by adding vinylic monomer or vinylic monomer and vinylic oligomer, which are liquid at ambient temperature, to at least one of a base material or a hardener, followed by subjecting the liquid vinylic monomer or vinylic monomer and vinylic oligomer to radical polymerization and simultaneously interpenetration-crosslinking with polyurethane during polyurethane polymerization of the base material and hardener.
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