| 摘要 |
A printed circuit board and a manufacturing method thereof are provided to realize high density by forming a bond finger on an insulation layer to additionally secure a width of the bond finger. In a printed circuit board, a first circuit pattern(201a) is formed on a top surface of an insulation layer(204). A second circuit pattern(205a) is electrically connected to the first circuit pattern(205a), and formed on a bottom surface of the insulation layer(204). A copper plating layer electrically conducts the first and second circuit patterns(201a,205a) by being formed on an inner wall of a via hole(206) formed on the insulation layer(204). A plating layer(208) is formed on right, left, and top surfaces of the first circuit pattern(201a), and a top surface of the copper plating layer.
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