| 摘要 |
<p>A movable electrostatic chuck is provided to reduce or remove a mechanical stress applied on the movable electrostatic chuck by manufacturing the movable electrostatic chuck with the material, which is used for manufacturing a wafer. A movable electrostatic chuck includes a first surface. The first surface electro-statically clamps thin process wafers, when a clamping voltage is applied to the first surface without continuously using an external power supply. Sizes and thicknesses of the movable electrostatic chuck and the clamped substrate are similar to those of a standard wafer. A non-uniform electric field is generated. A base material having electrodes is formed on plural single-pole or dipole electrode unit cells. The electrode unit cell includes an internal peak electrode, a side dielectric layer, a peripheral electrode, and an upper dielectric layer. The electrode unit cells are coupled with a cluster(4). The electrode unit cell has a length less than 5mum and a width less than 5mum.</p> |
