| 摘要 |
A method for forming a dummy pattern for a CMP process is provided to improve the uniformity in a chip and to enhance a CMP margin by inserting various dummy patterns in an active region and a metal film using DFM(Design For Manufacturing). A device pattern density is calculated by using DFM. A dummy pattern inserting program is obtained from the calculated device pattern density. The dummy pattern inserting program is capable of controlling a dummy pattern inserting process on an active region and a metal film according to the calculated device pattern density. Various dummy patterns(7,8) are substantially inserted into the active region and the metal film by applying the dummy pattern inserting program to a layout of the active region and the metal film.
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