| 摘要 |
A position correction method for a semiconductor manufacturing process is provided to correct accurately an error by performing a preset process, a flux process, and a ball attachment process by using one camera. A preset process(10) is performed to photograph a position of a target(40) and produce a position variation of the photographed target by driving a camera(60). A flux process(20) is performed to produce a position correction value of a fluxing unit(21) by using the position variation of the photographed target and the position variation of the fluxing unit. A ball attachment process(30) is performed to correct a position of a ball attachment unit(31) and perform a ball attachment process. A correction process is performed by using final correction values of the fluxing unit and the ball attachment unit.
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