MANUFACTURING METHOD OF ELECTRONIC COMPONENTS EMBEDDED PCB

摘要

A method for manufacturing electronic components embedded PCB is provided to prevent deterioration of an electrical characteristic for a surface of the electric components by mounting the electric components after a via hole is formed on a resin layer through mechanical drilling. A method for manufacturing electronic components embedded PCB includes the steps of: attaching an adhesive layer on a bottom surface of a resin layer and forming a through hole on a region corresponding to an electrode of the electronic components to be mounted(110); forming a plating layer inside the through hole after adhering a metal reinforcement material on a bottom surface of the adhesive layer(120); coating a conductive paste on a top of the plating layer(130); mounting the electronic components(140); stacking a copper resin layer including a first copper layer on a surface of the resin layer(150); forming a second copper layer on a bottom surface of the resin layer after removing the adhesive layer and the reinforcement material(160); and forming a circuit pattern to be electrically connected to the electronic components on the first copper layer and the second copper layer.