发明名称 High frequency electronic component
摘要 <p>A high frequency electronic component comprises a layered substrate. On the bottom surface of the layered substrate, there are provided a plurality of functional terminals for inputting and outputting signals relating to functions of a circuit inside the layered substrate, a plurality of ground terminals, a plurality of terminals that are not connected to external circuits, and a conductor section for grounding. The conductor section for grounding includes: a center portion located in a region surrounded by a plurality of terminals; and a plurality of coupling portions for coupling the center portion to the terminals.</p>
申请公布号 EP1746654(A2) 申请公布日期 2007.01.24
申请号 EP20060015073 申请日期 2006.07.19
申请人 TDK CORPORATION 发明人 OKUYAMA, YUICHIRO
分类号 H01L23/66;H01L23/498;H01L23/50;H04B1/48 主分类号 H01L23/66
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