发明名称 |
Process for exposing solder bumps on an underfill coated semiconductor |
摘要 |
<p>A process for applying a solvent-free underfill onto a bumped semiconductor comprises: providing an underfill in a compressible state on a semiconductor, contacting the underfill with a compliant surface and applying sufficient pressure to expose the bumps, optionally hardening the underfill to a solid state, and removing the compliant surface.</p> |
申请公布号 |
EP1746642(A2) |
申请公布日期 |
2007.01.24 |
申请号 |
EP20060015031 |
申请日期 |
2006.07.19 |
申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
CHAWARE, RAGHUNANDAN;DOMINIC, CHRISTOPHER |
分类号 |
H01L21/56 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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