| 摘要 |
A BGA(Ball Grid Array) type connector is provided to decrease a mounting area and increase the distance between BGA balls by reducing the area of a BGA ball so as to decrease a failure rate. A BGA type connector(10) includes a pin PCB(Printed Circuit Board)(12), a plurality of BGA balls(14), a plurality of vertical pins(16), and a plate(18). The plurality of BGA balls are formed on one side of the pin PCB at a predetermined interval. The plurality of vertical pins is formed on the other side of the pin PCB in the horizontal direction and is connected to the BGA balls through the pin PCB. The plate is combined with the pin PCB to support the vertical pins. The interval of the BGA balls is wider than the interval of the vertical pins. The ends of the vertical pins penetrate the plate to be exposed.
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