METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a multilayer printed circuit board is provided to reduce a manufacturing process such as photolithography and etching for forming a via hole to electrically connect a wiring pattern by simultaneously forming a window region during a formation of the wiring pattern. A method for manufacturing a multilayer printed circuit board includes the steps of: forming an external layer copper stacked plate, wherein a pair of wiring patterns(130,230) are formed on one surface of the external layer copper stacked plate and a window region(140) is formed on the other surface of the external copper stacked plate to perform a drilling process; forming an internal layer copper stacked plate(200), wherein a wiring pattern is formed on both sides thereof; stacking the external layer copper stacked plate by inserting an adhesive member into top and bottom side surfaces of the internal layer copper stacked plate(200); forming a via hole(150) to electrically connect the wiring pattern by performing copper plating after the drilling process; and forming an external layer wiring pattern(135) on the external copper stacked plate.