FLIP-CHIP PACKAGE HAVING SUBSTRATE WITH PLURAL HOLES

摘要

A flip chip package having a substrate with plural holes is provided to introduce an under fill material through the holes which are formed on the substrate, and easily discharge air generated between a semiconductor chip and the substrate through the holes. A flip chip package includes a semiconductor chip(10) having an active surface with plural bumps(11), a substrate(20) having circuit wiring patterns electrically connected to the bumps and plural holes formed on a mounting region, a resin encapsulating portion(40) encapsulating the semiconductor chip and an upper surface of the substrate, and solder balls(21) electrically connected to the circuit wiring patterns. The holes penetrate the substrate not to expose the circuit wiring patterns.