METHOD FOR FORMING PHOTORESIST PATTERN

摘要

Provided is a method for forming a photoresist pattern which has excellent adhesion so as to ensure high perpendicular and horizontal ratio on various kinds of substrate. The method for forming a photoresist pattern comprises the steps of: forming a photocatalyst film on a substrate(S10); forming a photoresist film of negative type on the photocatalyst film(S20); exposing the photoresist film to an ultraviolet lay(S30); heat-treating the photoresist film(S40); and developing the photoresist film(S50) to form a photoresist pattern. In the method, the photocatalyst film is formed from at least one material selected from the group consisting of TiO2, ZnO, SnO2, SrTiO3, WO3, B2O3 and Fe2O3.