发明名称 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
摘要 <p>A semiconductor memory device is provided to blow a residual metal pattern positioned on a conductive pattern when a conductive pattern explodes thermally by forming a conductive pattern under a fuse such that the conductive pattern absorbs energy of a laser beam to explode thermally. An insulation layer is formed on a substrate in a fuse region. A fuse(220c) is positioned on the insulation layer, having a stack structure composed of a conductive pattern(212a,212c) and a metal pattern(216a,216c). The conductive pattern can be a polysilicon pattern. The conductive pattern is made of a material which absorbs energy of a laser beam to explode thermally. The metal pattern is stacked on the conductive pattern. The insulation layer can be formed on a capacitor positioned in a cell array region.</p>
申请公布号 KR20070010420(A) 申请公布日期 2007.01.24
申请号 KR20050064965 申请日期 2005.07.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 MUN, CHEAR YEON
分类号 H01L21/82;H01L21/66;H01L21/8242 主分类号 H01L21/82
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