| 摘要 |
Disclosed is an epoxy resin composition which is capable of forming a cured product having a low dielectric constant and a dielectric loss tangent in a high frequency range. Also disclosed is a film obtained by using such an epoxy resin composition. The epoxy resin composition contains (A) one or more epoxy resins selected from the group consisting of novolac epoxy resins having a phenol skeleton and a biphenyl skeleton and bifunctional linear epoxy resins having a hydroxyl group with a weight average molecular weight of 10,000-200,000, and (B) a modified phenol novolac wherein at least a part of a phenolic hydroxyl group is esterified with a fatty acid. ® KIPO & WIPO 2007 |
