| 摘要 |
A condenser microphone for insertion packaging and a mother board including the same are provided to minimize an installation space of an electret condenser microphone without reducing largely the thickness of the electret condenser microphone. A mother board(11) includes a hole(12) formed at a predetermined position thereof and an electret condenser microphone(13) inserted into the hole. The electret condenser microphone includes a case having an open side, a sound conversion part including internal elements and a washer spring, and a printed circuit board having a pad. The internal elements are installed inside the case in order to convert the sound to an electrical signal. The washer spring is positioned between the internal elements in order to provide elastic force. The pad of the printed circuit board is electrically connected with the mother board. |
