发明名称
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a deposited multielement thin film of ZrxHfxCxNx on the surface of a microrooter used for the cutting of a printed circuit board. SOLUTION: The substrate is radiated by electron beams in air and heated in a vacuum so that the surface of the substrate is cleaned by ions. Further, a thin film is deposited thereon by a low temperature PVD method. Cations are generated by an arc ion device 1, and the cat ions relatively small in granules are selected through a filter 13 followed by the refining of the cations by an ion auxiliary device. The elemental material to be applied is small in granules and is high in adhesion, so that the thin film is too stable to peel off till the rooter (substrate) is destroyed.
申请公布号 JP3871491(B2) 申请公布日期 2007.01.24
申请号 JP20000095039 申请日期 2000.03.30
申请人 发明人
分类号 B23K15/00;C23C14/06;B23K101/34;C23C14/32 主分类号 B23K15/00
代理机构 代理人
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