MANUFACTURING METHOD OF RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
摘要
A method for manufacturing a rigid-flexible printed circuit board is provided to realize an automation of manufacturing processes by not remaining a residue on a surface of a circuit. A method for manufacturing a rigid-flexible printed circuit board includes the steps of: preparing a resin layer on which a predetermined circuit is formed on both surfaces thereof(110); forming a protection layer on the circuit except a portion of the circuit of the predetermined region of the resin layer(120); coating an etching resist ink on the portion of the circuit of the predetermined region and solidifying the coated etching resist ink(130); stacking an insulating layer and a copper layer on both sides of the resin layer except the predetermined region(140); and forming an external layer circuit on the copper layer by using a dry film(150).
申请公布号
KR100674300(B1)
申请公布日期
2007.01.24
申请号
KR20050094489
申请日期
2005.10.07
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
KIM, HA IL;YANG, DEK GIN;AN, DONG GI;YOU, KWANG SON