METHOD FOR MEASURING OF THE THICKNESS OF OSP FILM FOR SURFACE-PROCESSING PRINTED CIRCUIT BOARD

摘要

A method for measuring a thickness of an OSP(Organic Solderability Preservative) film for a surface-processing printed circuit board is provided to precisely measure a thickness of a submicron unit by performing high magnification measurement. A method for measuring a thickness of an OSP film for a surface-processing printed circuit board includes the steps of: preparing an OSP film thickness measuring sample by separating a pad of a printed circuit board on which the OSP film for surface-processing is coated; freezing the sample; forming a crack on the OSP film of the frozen sample; coating a conductive material on the cracked OSP film; and measuring a thickness of a fracture surface of the OSP film on which the conductive material is coated.