发明名称 HEATSINK MANUFACTURING METHOD FOR ELECTRONIC AND MECHANIC PARTS USING THERMAL CONDUCTIVITY OF PLASTIC
摘要 A method for manufacturing a heat sink for electronic and mechanical parts using a thermal conductive plastic and a manufactured article are provided to improve heat radiating efficiency and reduce weight of the heat sink. A heat sink includes a body plate(10), and a plurality of ribs formed on the body plate. The ribs include corner ribs(11 to 14) which are protruded from four corners of the body plate and have bolt mounting holes; a block type rib(15) which is protruded eccentrically from a center of the body plate, and has an upper center which is recessed, and bolt mounting holes formed at upper and lower portions of the recessed part; and a stepped rib(16) formed between left and right corner ribs(13,14).
申请公布号 KR100673028(B1) 申请公布日期 2007.01.24
申请号 KR20050094027 申请日期 2005.10.06
申请人 MANDO CORPORATION 发明人 HA, DONG HUN;KIM, SEONG SOO
分类号 B29C67/24;C08J5/00;C08K3/04 主分类号 B29C67/24
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