Side view led package and backlight unit using the same

摘要

The invention relates to a side-emission type LED package capable of minimizing light loss to achieve high luminance and to a backlight unit using the same. The LED package includes a lead frame with an electrode formed thereon and a light emitting diode chip disposed on the lead frame. The LED package further includes a body made of molded material surrounding the light emitting diode chip disposed on the lead frame, the body having an asymmetrical shape; and a reflecting part extended from a side of the body to downwardly reflect light emitted from the light emitting diode chip. The reflecting part is extended from the upper edge of the body housing the LED chip to effectively block light from leaking outside, thereby achieving high-luminance emission.