Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

摘要

A leadless type resin-sealed semiconductor package includes a resin enveloper having a mounting face to be applied to a wiring board, and at least one side face associated with the mounting face to produce an angled side edge. A semiconductor chip is encapsulated and sealed in the resin enveloper. An electrode terminal is partially buried in the angled side edge of the resin enveloper so as to be exposed to an outside, with the electrode terminal being electrically connected to the semiconductor chip. The electrode terminal is formed with a depression which is shaped so as to be opened to an outside when the resin enveloper is placed on the wiring board such that the mounting face of the resin enveloper is applied thereto.