发明名称 Plasma electroplating
摘要 A method for depositing a film of an advanced material on a surface of an article is disclosed. The method comprises placing the article within a bath having a pair of spaced electrodes one of which is formed by the article and an electrolyte containing a source of the material to be deposited. A stream of bubbles is generated within the electrolyte adjacent to the cathode. A potential difference is applied across the cathode and anode such that a plasma glow discharge is formed in the bubble region. The plasma of ionised gaseous molecules formed within the bubble region acts to deposit a film of material on the surface of the article. The method may be carried out at atmospheric pressure and does not require a vacuum apparatus. An apparatus for carrying out this method is also disclosed.
申请公布号 US7166206(B2) 申请公布日期 2007.01.23
申请号 US20020130582 申请日期 2002.09.10
申请人 发明人 CHEN ZHUPING
分类号 C25D5/00;H05H1/24;C23C16/50;C23C26/00;C25D5/18;C25D5/20;C25D7/00;C25D9/02;C25D9/04;C25D21/02;C25D21/12 主分类号 C25D5/00
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