Disclosed are electrolyte compositions for depositing tin or tin-alloys at various current densities. Also disclosed are methods of plating such tin or tin-alloys on substrates, such as the high speed tin plating of steel.
申请公布号
USRE39476(E1)
申请公布日期
2007.01.23
申请号
US20050032658
申请日期
2005.01.10
申请人
SHIPLEY COMPANY, L.L.C.
发明人
BROWN NEIL D.;FEDERMAN GEORGE A.;CHIRAFISI ANGELO B.;LAI GREGORY
