发明名称 ELECTRIC OR ELECTRONIC DEVICE HAVING SOLDER JOINT
摘要 Zn: 3.0 to 14.0 wt %, Al: 0.0020 to 0.0080 wt %, and balance: Sn and inevitable impurities; an alloy for solder having a chemical composition: Zn: 3.0 to 14.0 wt %, Bi: 3.0 to 6.0 wt %, Al: 0. 0020 to 0.0100 wt %, and balance: Sn and inevitable impurities; and a solder joint in electric or electronic equipment which comprises the alloy for solder. The alloy for solder has no adverse effect on the environment and exhibits good solderability comparable to that of a conventional Pb-Sn solder. ® KIPO & WIPO 2007
申请公布号 KR20070010204(A) 申请公布日期 2007.01.22
申请号 KR20067027254 申请日期 2006.12.26
申请人 FUJITSU LIMITED 发明人 KITAJIMA MASAYUKI;SHONO TADAAKI;HONMA HITOSHI;TAKESUE MASAKAZU;NODA YUTAKA
分类号 B23K35/24;C22C13/00;B23K35/26;C22C13/02 主分类号 B23K35/24
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