| 摘要 |
A condenser microphone and a packaging method for the same are provided to reduce a processing cost and a manufacturing cost by bonding a PCB and a metallic case with an adhesive without a curling process. A metallic case(110) includes a sound hole. A MEMS(Micro Electro Mechanical System) microphone chip(10) is used for converting sound received through the sound hole to an electrical signal. An ASIC(Application Specific Integrated Circuit) chip(20) includes a voltage pump for providing a voltage to be applied to the MEMS microphone chip and a buffer IC for amplifying the electrical signal of the MEMS microphone chip. The MEMS microphone chip and the AISC chip are mounted on a PCB(Printed Circuit Board)(120). A connective pattern is formed on the PCB in order to be bonded with the metallic case. A fixing unit fixes the metallic case to the PCB. An adhesive(140) is used for attaching the PCB and the metallic case to each other. |
