A wafer structure is provided to restrain the generation of a die attach failure by identifying exactly a first die using an improved mirror shot structure composed of first and second mirror shot regions. A wafer structure(110) includes a first mirror shot region(130). The position of a first die is detected by using the first mirror shot region as a reference. The wafer structure further includes a second mirror shot region(140). The second mirror shot region is located at a predetermined portion opposite to the first mirror shot in a diagonal direction. The first die is located at a peripheral region of one out of the first and second mirror shot regions.
