LIGHT EMITTING DIODE PACKAGE

摘要

An LED(Light Emitting Diode) package is provided to minimize the reaction of the package on a molding member and to improve a heat radiation efficiency by forming the package using aluminum or aluminum alloy. One or more LED chips(60) are mounted on a first region of a first package. A second package is formed under a second region of the first package. The second package is insulated from the first region through an insulating member. The second package is used as a second electrode. A wire(70) is used for connecting the LED chip with the second package. A molding member is filled in the second region of the first package in order to protect the LED chip and the wire. The first and second packages are made of aluminum or aluminum alloy.