| 摘要 |
A silicon-based condenser microphone is provided to enhance bonding strength and mechanical rigidity by bonding a metallic case and a PCB(Printed Circuit Board) by using a laser welding method. A metallic case(110) has a closed bottom face. A substrate(120) includes a sound hole(120a) for receiving sound and a sealing terminal(120b) for sealing the sound hole by using a soldering method. A connective pattern(121) is formed on a bonding surface of the metallic case. The connective pattern is connected with the connective terminal. The metallic case is bonded with the connective pattern by using a welding method. A MEMS(Micro Electro Mechanical System) microphone chip(10) is mounted on the substrate in order to convert the sound to an electrical signal. An ASIC(Application Specific Integrated Circuit) chip(20) is mounted on the substrate in order to apply a voltage to the MEMS microphone chip, amplify the converted electrical signal, and transmit the amplified signal through the connective terminal to a main PCB. |
