| 摘要 |
A semiconductor wafer alignment apparatus is provided to shorten an operation time by carrying out flat zone alignment of a wafer on a chuck in a process chamber. A semiconductor wafer alignment apparatus includes a chuck(14) sucking a wafer(W), a drive motor(18) rotating the chuck, a position detecting sensor(22) installed on an edge of the wafer for detecting a flat zone of the wafer, and a controller(24) controlling the drive motor in response to a signal applied from the position detecting sensor. The position detecting sensor is a photo sensor having a light emitting element and a light receiving element(28).
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