| 摘要 |
[PROBLEMS] To provide a solder ball mounting device capable of mounting micro solder balls on electrodes. [MEANS FOR SOLVING PROBLEMS] The solder balls (78s) are collected by sucking air from a mounting tube (24) positioned above a ball arranging mask (16). The collected solder balls (78s) are rolled on the ball arranging mask (16) by horizontally moving the mounting tube (24), and the solder balls (78s) are fallen onto the electrodes (75) of a multi-layer printed wiring board (10) through the openings (16a) of the ball arranging mask (16). ® KIPO & WIPO 2007 |
