| 发明名称 |
METHOD FOR FORMING ORGANIC SILICA FILM, ORGANIC SILICA FILM, WIRING STRUCTURE, SEMICONDUCTOR DEVICE, AND COMPOSITION FOR FILM FORMATION |
| 摘要 |
<p>Disclosed is a method for forming an organic silica film which comprises a step wherein a coating film composed of a silicon compound having an -Si-O-Si- structure and an -Si-CH2-Si- structure is formed on a base, a step for heating the coating film, and a step for curing the coating film through irradiation of ultraviolet light. ® KIPO & WIPO 2007</p> |
| 申请公布号 |
KR20070010081(A) |
申请公布日期 |
2007.01.19 |
| 申请号 |
KR20067025873 |
申请日期 |
2005.04.28 |
| 申请人 |
JSR CORPORATION |
发明人 |
AKIYAMA MASAHIRO;NAKAGAWA HISASHI;YAMANAKA TATSUYA;SHIOTA ATSUSHI;KUROSAWA TAKAHIKO |
| 分类号 |
C08G77/00;C09D183/04;C08G77/32;C08G77/42;C08G77/50;C08J5/22;C08L83/14;C09D5/25;C09D183/14;H01B3/46;H01L21/3105;H01L21/312;H01L21/316;H01L21/768;H01L23/522 |
主分类号 |
C08G77/00 |
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