| 摘要 |
PROBLEM TO BE SOLVED: To provide a production method of a buildup multilayer printed wiring board which is not affected by an area ratio of a wiring pattern or a presence or absence of an IVH, is small in variations of a thickness, has a surface with a smooth insulating layer, and does not generate voids in the IVH or voids in an LVH. SOLUTION: This production method comprises the first coating step in which first insulating resin ink is coated on both face sides of a wiring board 9 by use of a first roll coater to form first resin ink layers 18a, 18b; the second coating step in which second insulating resin ink 11b is coated on surfaces of the first resin ink layers 18a, 18b, by use of a second roll coater 10b to form a second resin ink layer; and the curing step of curing the first resin ink layers 18a, 18b and the second resin ink layer at the same time. This production method optimizes respective coating conditions of the first coating step and the second coating step. COPYRIGHT: (C)2007,JPO&INPIT |
