发明名称 RESIN COMPOSITION EXCELLENT IN HEAT DISSIPATION AND HEAT-DISSIPATING RESIN SHEET
摘要 PROBLEM TO BE SOLVED: To provide a resin composition excellent in heat conductivity, having slight volatile component by heating and remarkably suppressed in occurrence of cut powder in an extrusion process, and a heat-dissipating resin sheet using the resin composition. SOLUTION: The resin composition comprises (I)≥1 wt.% and≤20 wt.% one or more kinds of thermoplastic resins selected from polyamide-based resins, polyacetal-based resins, polyphenylene ether-based resins, polycarbonate-based resins, ABS-based resins, polyolefin-based resins, polystyrene-based resins, methacrylate-based resins and thermoplastic elastomers and (II) >80 wt.% and≤99 wt.% zinc oxide composed of a needle crystal having a nuclear part and extending to different four axial directions from the nuclear part. The heat-dissipating resin sheet is obtained by molding the resin composition. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007009084(A) 申请公布日期 2007.01.18
申请号 JP20050192615 申请日期 2005.06.30
申请人 ASAHI KASEI CHEMICALS CORP 发明人 MOTOI YASUAKI;HASHIMOTO KAZUHIKO
分类号 C08L101/00;C08K3/22 主分类号 C08L101/00
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