| 摘要 |
A mobile transportable electrostatic chuck for clamping thin wafers ( 12 ) without permanent connection to an external power supply unit is described. The mobile chuck allows a safe handling of thin substrates on existing production equipment because the size and thickness of the clamped substrate on the mobile chuck is similar to a standard wafer. The chuck is made from silicon wafers itself as base material ( 11 ) using an IC manufacturing processes. Bipolar electrode-unit-cells ( 10 ), combined into clusters ( 4 ) and linked to an integrated fuse ( 5 ), generate a non-uniform electric field with additional force components. Peak-electrodes ( 1 ) are introduced with the highest field density in the peak region and thus creating a three dimensional non-uniform electric field with each surrounding electrode ( 3 ). Quadratic or hexagonal electrode-unit-cells ( 10 ) enable the highest dense of unit cells, which effectively clamp wafers ( 12 ) in close proximity to the surface ( 8 a) of the chuck at elevated temperatures.
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