EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

An epoxy resin composition for semiconductor sealing that contains no hazardous substances out of regard for environment and excels in soldering heat resistance at the time of mounting and further in productivity; and a semiconductor device including sealing thereby. There is provided an epoxy resin composition for semiconductor sealing, characterized in that not only are an epoxy resin of given structure (A) and a phenolic resin of given structure (B) contained as main components but also a phenolic resin wherein the area ratio of a component having three or less aromatic rings per molecule in GPC analysis is 0.8% or less is contained as an essential component. Further, there is provided a semiconductor device characterized in that it comprises a semiconductor element sealed with the epoxy resin composition. ® KIPO & WIPO 2007