| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bump wiring structure capable of preventing current concentration in the joint of a bump and uniformizing a current density. <P>SOLUTION: A wiring layer 41 is provided separately from a connection pad 32 to which the bump 37 is joined. A plurality of columnar conductors 43 are arranged for electrically connecting the connection pad 32 and the wiring layer 41. By arranging the columnar conductors 43 over the entire joint region corresponding to the joint of the bump 37, the current density is uniformized in the joint. Also, by changing the arrangement density of the columnar conductors 43 corresponding to the direction of an electron flow, the current density is further uniformized in the bump joint. <P>COPYRIGHT: (C)2007,JPO&INPIT |
