| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit unit which has no positional displacement between electronic circuit components and uses an inexpensive reflow device, and also to provide a method for manufacturing the unit. SOLUTION: The electronic circuit unit or the method for manufacturing the unit comprises solder bumps 3 formed on first lands 2a of a circuit board 1, an electronic circuit component 5 soldered by the solder bumps 3, and solder terminals 4 provided to second lands 2b of the circuit board 1. Since the solder bump 3 is made of melted mixture solder containing a first solder material and a second solder material higher in melting temperature than the first solder material, the melting temperature of the solder bump 3 is higher than that of the first solder material. Consequently, when the reflow device is set at a temperature at which the solder bump 3 is not melted, the solder bump 3 can be prevented from being melted, the position displacement can be avoided between the electronic circuit components 5, the reflow device can be simplified and made inexpensive. COPYRIGHT: (C)2007,JPO&INPIT |
