| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is suitable for an electronic material such as a printed wiring board and has a high glass transition temperature, low dielectric constant characteristic, low dielectric dissipation factor characteristic, and excellent heat resistance. SOLUTION: The thermosetting resin composition contains a benzoxazine resin represented by general formulas (1) and (2) or contains a benzoxazine resin prepared by reacting a compound represented by general formulas (3) and (4) with a primary amine represented by general formula (5) in the presence of formaldehyde. A molded article prepared by hardening the thermosetting resin is also provided. COPYRIGHT: (C)2007,JPO&INPIT |
