| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which the number of terminal lands can be increased, without being limited by the number of interconnect lines which can be passed between a plurality of terminal lands and the terminal lands can be arranged at high density, and to provide an ink jet head mounted with the wiring board. SOLUTION: Interconnect lines for driving 21a, 21a, ... from a drive IC are passed between terminal lands 24, 24, ... and are connected to respective terminal lands 24, 24, .... When more interconnect lines than those which can be passed between terminal lands 24, 24, ... are required, the interconnect lines for driving 21a, 21a, ... from the drive IC are routed via the outside of the array of a plurality of terminal lands 24, 24, ... and are connected to respective terminal lands 24, 24, .... COPYRIGHT: (C)2007,JPO&INPIT
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