| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently release heat generated, especially, at driving and at assembly of a light emitting diode package; relating to a light emitting diode package, manufacturing method thereof, a backlight unit using the same, and a liquid crystal display. <P>SOLUTION: A metal material of high heat conductivity is formed at the upper part of an electrode pattern so that the heat radiation effect of a light emitting diode package is maximized. Fixing and injection processes for plastic lens and silicon are performed after a solder process to prevent deformation, resulting in the light emitting diode package of uniform brightness. A backlight unit and a liquid crystal display is provided with the light emitting diode package mounted thereon for improved optical efficiency. A heat radiation layer containing metal material is formed at the lower part of a light emitting diode body to maximize heat radiation effect. Fixing and injection processes for plastic lens and silicon are performed after the solder process to prevent deformation. <P>COPYRIGHT: (C)2007,JPO&INPIT |
