| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board in which heat can be dissipated effectively to the outside even if a plurality of electronic components such as light emitting elements are mounted, and optical interference can be suppressed among light emitting elements when the light emitting elements are mounted as the electronic components. <P>SOLUTION: The wiring board 1 comprises a substrate body 2 composed of ceramic (insulating material) and having a surface 3 and a rear surface 4, a cavity 5 opening to the surface 3 of the substrate body 2 and composed of a bottom face 6 and a side face 8, a first pad 10 formed on the bottom face 6 of the cavity 5 and mounting a plurality of electronic components C1-C3, and a plurality of second pads 13, 15 and 17 formed on the bottom face 6 of the cavity 5 around the first pad 10. In a plurality of mounting areas a1(a2, a3) formed at the position of the first pad 10 opposing the plurality of second pads 13, 15 and 17, the distance Y of the cavity 5 to the periphery 7 of the bottom face 6 is shorter than the distance X between other closest mounting areas a2 and a3(a1). <P>COPYRIGHT: (C)2007,JPO&INPIT |
