| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which visibility of the name of a manufacturer and a serial number to be impressed on the surface of a backside resin layer by laser processing can be improved. SOLUTION: The semiconductor device 1 is provided with a semiconductor chip 10, and the backside resin layer 12 formed on a backside 10b of the semiconductor chip 10. A material in which a filler within a range of 5 wt.% to 10 wt.% is blended to a resin 16 is used for the resin material of the resin layer 12. COPYRIGHT: (C)2007,JPO&INPIT
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