发明名称 CIRCUIT CONNECTING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a circuit connecting material for electricity/electron which is excellent in heat resistance, moisture resistance, and work efficiency, and in which severe reliability is demanded especially. SOLUTION: The circuit connecting material is composed of an adhesive composition which contains (1) phenoxy resin, (2) naphthalene-based epoxy resin, and (3) a latent curing agent as indispensable components, and conductive particles. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007012626(A) 申请公布日期 2007.01.18
申请号 JP20060208688 申请日期 2006.07.31
申请人 HITACHI CHEM CO LTD 发明人 YANAGAWA TOSHIYUKI;FUJINAWA MITSUGI;OTA TOMOHISA
分类号 H01B1/20;C09J7/00;C09J9/02;C09J163/00;H01B5/16;H01R4/04 主分类号 H01B1/20
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