<p>A table (13) is provided for adhering an adhesive sheet (S) on an upper plane of a semiconductor wafer (W). The table (13) is composed of an outer table (51) and an inner table (52). The outer table (51) and the inner table (52) are arranged to move up and down through single axis robots (54, 56), respectively, and the inner table (52) is arranged to move up and down at the same time when the outer table (51) is moved up and down.</p>
