SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

摘要

A semiconductor device is provided to prevent a connection portion of an external connection terminal from being covered with an under fill resin by protruding the external connection terminal beyond semiconductor chips. A semiconductor device includes plural semiconductor chips(11-1,11-2,12-1), and a substrate(13) having an external connection terminal(27) electrically connected to the semiconductor chips. The external connection terminal is disposed on the substrate to be connected with the semiconductor chips. The external connection terminal is a columnar conductive member. A flip chip connection is made between the semiconductor chips and the substrate. An under fill is interposed between the semiconductor chips and the substrate.