发明名称 COMPOSITON OF SLURRY
摘要 Provided is a slurry composition, which contains a reduced content of metal oxide, has an improved polishing speed, reduces a polishing process cost, and hardly causes environmental pollution. The slurry composition comprises 0.01-5wt% of metal oxide, 0.1-2.0wt%, based on the weight of the metal oxide, of a polishing accelerator, 0.01-0.05wt%, based on the weight of the metal oxide, of a dispersion stabilizer, and the balance of deionized water and/or a pH controller. A content of the metal oxide is 0.1-0.5wt% based on the slurry composition. The metal oxide is ceria, silica, alumina, titania, zirconia, germania, or a mixture thereof.
申请公布号 KR20070008918(A) 申请公布日期 2007.01.18
申请号 KR20050062819 申请日期 2005.07.12
申请人 SAMSUNG CORNING CO., LTD. 发明人 KIM, JONG YOUNG;LEE, IN YEON;PARK, SANG KYU;YANG, JUNG MO
分类号 C09K3/14 主分类号 C09K3/14
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